HI-FILL BOND

7th generation single-component bond system; a self-etch adhesive system containing etching, primer and bonding agents together. Easy and Fast Application: Shortens application time thanks to its single-component structure. Minimum Technical Precision: Requires less technical precision compared to traditional total-etch systems in terms of moisture control. Reduced Post-Operative Sensitivity: Reduces the risk of sensitivity by ensuring dentin tubule closure. Low Film Thickness: The thin film layer increases the adaptation of the restoration. High Bond Strength: Provides strong bonding to both enamel and dentin. The first generation single-component bond system is a self-etch bonding system used in dentistry where etching, primer, and bonding agents are combined in a single system. These systems provide effective bonding to both dentin and enamel surfaces, offering ease of application and time savings. It is suitable for use in selective etch applications (roughening only the enamel surface with phosphoric acid) and total etch applications (roughening both the enamel and dentin surfaces with phosphoric acid). It is a light-polymerizing universal bonding agent that provides ideal adhesion and bonding strength.

• Bonding of direct restorations in all cavity classes (Black classification) using light-curing, dual or self-polymerizing methacrylate-based composites/compomers.
• Bonding of light-activated, dual or spontaneously polymerizing core-building materials.
• Covering excessively sensitive tooth areas.
• Covering the cavity surfaces before amalgam application.
• Bonding of fissure sealants.
• Cavity and core preparations must be sealed before temporary cementation of indirect restorations (in accordance with the dentin sealing technique applied without delay).
• Cementation of indirect restorations with light-curing, dual, or self-polymerizing adhesive resin cements.
• Intraoral repair of composite and compomer restorations, metal-supported porcelain and all-ceramic restorations, and metal restorations.