EndoSequence Root Repair Material - Putty Kit - 3g 5018266U0

Premixed and available in an injectable or putty consistency, EndoSequence Root Repair Material provides superior handling and healing properties for all of your root repair needs. This highly radiopaque and hydrophilic material has a very small particle size and unique composition that allows it to bond to dentin. It utilizes the moisture naturally present in the dentin to initiate and complete its setting reaction, and it is antibacterial during setting due to its highly alkaline pH. U.S. Patent Nos.: 7,553,362, 7,575,628, 8,343,271, 8,475,811 European Patent Nos.: 1861341 A4, 2142225 B1