E-Bond LC 75267

Bisico Bielefelder Dentalsilicone GmbH & Co. KG · #75267

Automatically collected from bisico.de

Are you the manufacturer?Send us your data

E-Bond LC is a self-etching, light-curing one- component adhesive and can be used in combination with all light-curing composite materials available on the market. lt develops a very strong bonding of composites to enamel and dentin. With bond strength values of 24 and 22 Mpa on enamel and dentine E Bond LC is one of the top products used in this field. E-Bond LC ensures a long-lasting high marginal seal between composite and enamel/dentin and thus prevents secondary caries. A long-lasting stability of the restorations is the result. Another important advantage is the time saving due to the simple handling. The bothersome etching of enamel and dentine is no Ionger necessary. With E-Bond LC etching, priming and bonding are done in a single step. The simple application of the material onto the moist enamel and dentin is sufficient to produce a durable, long lasting restoration. E-Bond LC does not contain any solvents and can be stored at room temperature.

Product Information

ManufacturerBisico Bielefelder Dentalsilicone GmbH & Co. KG
CuringLichthärtend
Volume5 ml bottle
Free ofTEGDMA, MMA
Ph Wert> 2
TechniqueSelf-Etch-Technik und Selective-Etch-Technik
Includes1 brush holder, 25 EW brushes, Mixing modules (6-well)
LagerungKeine Kühlschrank-Lagerung erforderlich
ApplicationEin-Schritt-Anwendung - Ätzen, Primen, Bonden in einem Arbeitsschritt
ComponentsOne-component
ConsistencyHonigartig
Product typeEin-Komponenten-Adhäsiv
Package contents5 ml Flasche (inkl. Pinselhalter, EW-Pinsel, Mischpaletten)

Documents