3M™ Sondhi™ Rapid-Set Indirect Bonding Adhesive – 1/Kit 712-070
Solventum · #712-070
Automatisch erfasst von solventum.com
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Herstellertext auf Englisch
Sondhi™ Rapid-Set Indirect Bonding Adhesive is designed for indirect bonding of orthodontic brackets. The quick set time is specialized for indirect bonding and is not recommended for standard direct ortho bonding techniques.
Product details
- Two-part resin system
- No mixing of Resin A and Resin B
- Give your patient a faster, more comfortable, more confident bonding experience
Suggested Applications
Sondhi™ Rapid-Set Indirect Bonding Adhesive Kit is intended for indirect bonding of orthodontic brackets. The quick set time of the adhesive does not allow sufficient time for standard direct bonding techniques.
3M™ Sondhi™ Rapid-Set Indirect Bonding Adhesive – 1/Kit 712-070 #712-070 3M™ Sondhi™ Rapid-Set Indirect Bonding Adhesive – Resin A, , 10 ml,1/Btl 712-072 #712-072 3M™ Sondhi™ Rapid-Set Indirect Bonding Adhesive – Resin B, , 10 ml,1/Btl 712-073 #712-073
Ihre Auswahl 3M™ Sondhi™ Rapid-Set Indirect Bonding Adhesive – 1/Kit 712-070
Produktinformationen
| Hersteller | Solventum |
|---|---|
| Marke | Sondhi™ |
| Variante | 3M™ Sondhi™ Rapid-Set Indirect Bonding Adhesive, 712-070, 1/Kit |
| Härtungsart | Chemical Cure |
| Produkttyp | Indirect Bonding Adhesive Kit |
| Delivery System | Flasche |
Dokumente zur Produktlinie
- Orthodontic Product Catalog Broschüre