3M™ Sondhi™ Rapid-Set Indirect Bonding Adhesive Resin B
Solventum
Collecté automatiquement depuis solventum.com
Vous êtes le fabricant ?Transmettez vos données
Texte du fabricant en anglais
The Sondhi™ Rapid-Set Indirect Bonding Adhesive is revolutionary from every angle. Lightly filled resins cure chemically in half the time of other indirect adhesives, while achieving two-thirds of its bond strength within the first five minutes.
- Less bracket repositioning
- More control and accurate bracket placement second molar to second molar
- No mixing of Resin A & B required
Informations produit
| Fabricant | Solventum |
|---|---|
| Catégorie | Orthodontic Bonding |
| Taille de l'emballage | 10 ml |