High-Q-Bond Bracket

Light-cure bracket adhesive system

Direct bonding of metal and ceramic orthodontic brackets to tooth surfaces

Properties

• Bonds chemically and mechanically for a superior bond, while flowing into the tightest mesh without bracket drift.
• A light-cure material - compatible with all curing units available on the market.
• Depth of cure is > 4 mm.
• Glass filled material designed specifically for orthodontic use that allows maximum penetration of filler into the finest screen mesh base.
• The viscosity of High-Q-Bond Bracket was designed to prevent adhesive run-on and bracket skating.
• Marketed since 2007 with no changes in formula. No complaints of any health-related or chemical performance issues were received.

Technical Data

Adhesive bonding to etched enamel: >15 MPa, in the 30 – 35 MPa interval.
Adhesive bonding to pretreated metal surface: > 10 MPa.
Adhesive bonding to pretreated porcelain surfaces: > 5 MPa.
Flexural strength: >50, in the 100 – 150 MPa interval.
Solubility: ≤7.5 μg/mm³
Water sorption: ≤40 μg/mm³
Light curing time: 10 – 20 seconds
Film thickness: ≤50 μm
Compatible with LED: Yes
Compatible with halogen light: Yes
Compatible with plasma arc light lamp: Yes
Shelf life: 2 Years