CAD/CAM Implant Level Scan Body (ET) compatible with Osstem® TSII/TSIII SA/SOI Ø4.0 - Ø7.0 CC RP
Edison Medical compatible avec Osstem TSII/TSIII SA/SOI · #113098-118-381
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CAD/CAM Implant Level Scan Body compatible with Osstem®
Fits with: Osstem® - Conical Conn. TS™ System RP
Platforms: RP
Material: PEEK - POLYETHER ETHER KETONE
Recommended Torque Tightening: 20 NCM
Required Screwdriver: 0.5" | 1.25mm Hex
Main advantages
Time efficient and quicker workflow
Easier collaboration with your lab
Biocompatible and allergy / metal free
Can be reused, cost-effective solution
Predictable results
Please note: Prior to scanning, please verify that the scanned abutment is available for you in the design software library
Votre sélection CAD/CAM Implant Level Scan Body (ET) compatible with Osstem® TSII/TSIII SA/SOI Ø4.0 - Ø7.0 CC RP
Informations produit
| Fabricant | Edison Medical |
|---|---|
| Matériau | PEEK - POLYETHER ETHER KETONE |
| Plateforme | RP |
| S'adapte à | Osstem® - Conical Conn. TS™ System RP |
| Connexion | Osstem® - TSII/TSIII SA/SOI Ø4.0 - Ø7.0 CC RP |
| Tournevis requis | 0.5" | 1.25mm Hex |
| Système implantaire compatible | Osstem® TSII/TSIII SA/SOI |
| Plateforme implantaire compatible | Ø4.0 - Ø7.0 CC RP |
| Couple de serrage recommandé | 20 NCM |